Call For Paper

The 8th International Conference on Communications, Signal Processing, and Systems (CSPS)

July 20-22 2019, Urumqi, China

Sponsored by:

IEEE Fort Worth Section, USA

IEEE Women in Engineering of Harbin Section, China

University of Texas at Arlington, USA

University of Strathclyde, UK

Xinjiang Normal University, China

Tianjin Normal University, China

Dalian University of Technology, China

Dalian Maritime University, China

Harbin Institute of Technology, China

University of Electronic Science and Technology, China

Beijing University of Posts and Telecommunications, China

Shanghai Jiaotong University, China

 

The 8th International Conference on Communications, Signal Processing, and Systems (CSPS) will be held in July 2019 in Urumqi, China. Prospective authors are invited to submit original technical papers for oral or poster presentations at CSPS and publication in the Conference Proceedings. The papers in communications, signal processing, and systems are solicited in the following topics, but are not limited to:

All accepted papers will be published in Lecture Notes in Electrical Engineering, a book series published by Springer, and is indexed by EI-indexed, ISI Proceedings, SCOPUS, MetaPress, Springerlink.

The 1st, 2nd, 3rd, 4th, 5th 6th and 7th International Conference on Communications, Signal Processing, and Systems (CSPS) were held in Beijing in October 2012, in Tianjin in September 2013, in Hohhot in July 2014, in Chengdu in October 2015, in Chongqing in October 2016, in Harbin in July 2017, in Dalian in July 2018 respectively. In the previous seven conferences, more than 350 papers (after further extension) were selected into the following 10 SCI journals.

•EURASIP Journal on Wireless Communications and Networking

•Wiley Security and Communication Networks (SCN) Journal

•International Journal of Sensor Networks

•EURASIP Journal on Advances in Signal Processing

•(Elsevier) Physical Communications

•(Elsevier) Signal Processing

•(Elsevier) Ad Hoc Networks

•(Elsevier) Pattern Recognition

•Mobile Information Systems

•International Journal of Distributed Sensor Networks

It is expected that similar number of papers will be selected into SCI journals in 2019 CSPS conference.

 

Submission:

All submissions should be written in English with a maximum paper length of eight (8) printed pages including figures without incurring additional page charges.

Standard Springer book templates are available for both LaTeX and Microsoft Word format.

Please be aware that Springer book template size is much smaller than that of IEEE template (almost half size).

Only PDF files will be accepted for the review process and all submissions must be done through EasyChair.

Authors can use the link below for submission:

https://easychair.org/conferences/?conf=csps2019

Important Dates:

Paper Submission Deadline:  April 20th, 2019

Acceptance Notification:  June 15th, 2019

Camera Ready Paper: July 1st, 2019

 

General Co-Chairs:

Tariq S. Durrani, University of Strathclyde, UK

Weimin Pan, Xinjiang Normal University, China

Qilian Liang, University of Texas at Arlington, USA

Yiming Pi, University of Electronic Science and Technology, China

Baoju Zhang, Tianjin Normal University, China

 

TPC Co-Chairs:

Bingcai Chen, Xinjiang Normal University, China

Qian Ning, Xinjiang Normal University, China

Dongmei Xie, Xinjiang Normal University, China

Min Jia, Harbin Institute of Technology, China

Xin Liu, Dalian University of Technology, China

Wei Wang, Tianjin Normal University, China

Jing Liang, University of Electronic Science and Technology, China

Feng Zhao, Yulin Normal University, China

Zhenyu Na, Dalian Maritime University, China

Jiasong Mu, Tianjin Normal University, China

Xuemai Gu, Harbin Institute of Technology, China

Zan Li, Xidian University, China

Qihui Wu, Nanjing University of Aeronautics and Astronautics, China

Qinyu ZhangHarbin Institute of Technology, China

Shi Jin, Southeast University, China

Mugen Peng, Beijing University of Posts and Telecommunications

Feifei Gao, Tsinghua University, China

 

International Advisory Committee:

Tieniu Tan, Chinese Academy of Science, China

Victor C.M. Leung,University of British Columbia, Canada

Kat-Kit Wong, University College London, UK

Gene Frantz, Texas Instruments, USA

ErMeng Hwa, Nanyang Technological University, Singapore

ZhishengNiu, Tsinghua University, China

Qing Guo, Harbin Institute of Technology, China

Wan-Chi Siu, Hong Kong Polytechnic University, Hong Kong

Arumugam Nallanathan, King’s College London, UK

Yan Zhang, University of Oslo, Norway

F. Richard Yu, Carleton University, Canada

Yunfei Chen, University of Warwick, UK

Hongjian Sun,Durham University, UK

Wei Xu, Southeast University, China

Publication Co-Chairs:

Yue Wang, Tianjin Normal University, China

Zuo Sun, Beijing University of Posts and Telecommunications, China

YulongZou, Nanjing University of Posts and Telecommunications, China

Hui Li, Hainan University, China

Guoru Ding, Southeast University, China

Xiaoming Chen, Zhejiang University, China

Yueling Che, Shenzhen University, China

Su Hu, University of Electronic Science and Technology of China, China

Xinlin Huang, Tongji University, China

Yun Lin, Harbin University of Engineering, China

Jie Tang, South China University of Technology, China

Chungang Yang, Xidian University, China

Feng Shu, Nanjing University of Science and Technology, China

Qinghe Du, Xi'an Jiaotong University, China

Wei Wang, Zhejiang University, China

Publicity Co-Chair:

Guan Gui, Nanjing University of Posts and Telecommunications, China

Liang Xiao, Xiamen University, China

Xiaopeng Yang, Beijing Institute of Technology, China

Gongliang Liu, Harbin Institute of Technology (Weihai), China

Haijun Zhang, University of Science & Technology Beijing, China

Qingquan Sun, California State University San Bernardino, USA

Xiaofei Zhang, Nanjing University of Aeronautics and Astronautics, China

Zilong Liu, Nanyang Technological University, Singapore

Yuan Zhou, Tianjin University, China

Yong Li, Tsinghua University, China

Jingjiang Wang, Qingdao University of Science and Technology, China

Ning Wang, Zhengzhou University, China

YunjianJia, Chongqing University, China

Qingjiang Shi, Nanjing University of Aeronautics and Astronautics, China

Keynote Co-Chairs

Jean X. Gao, University of Texas at Arlington, USA

Shenghong Li, Shanghai Jiaotong University, China

Haibo Zhou, Naijing University, China

Lei Chen, Georgia Southern University, USA

Weijie Xia, Nanjing University of Aeronautics and Astronautics, China

Yong Zeng, National University of Singapore, Singapore

Tingting Zhang, Harbin Institute of Technology (Shenzhen), China

Jun Li, Nanjing University of Science and Technology, China

Jingyu Hua, Zhejiang University of Technology, China

Weigang Chen, Tianjin University, China

Rong Chai, Chongqing University of Posts and Telecommunications

Lusheng Wang, HeFei University of Technology, China

Yanjing Sun, China University of Mining and Technology, China

Rongfei Fan, Beijing Institute of Technology, China

Local Arrangement Co-Chairs:

Mei Nian, Xinjiang Normal University, China

Zhiming Ma, Xinjiang Normal University, China

Yong Yang, Xinjiang Normal University, China

Minglu Jin, Dalian University of Technology, China

Nan Zhao, Dalian University of Technology, China

Xufen Xie, Dalian Polytechnic University, China

Jie wang, Dalian University of Technology, China

Hui Li, Dalian University of Technology, China

Registration & Financial Co-Chairs:

Xiangwei Qi, Xinjiang Normal University, China

Haifang Li, Xinjiang Normal University, China

Liang Han, Tianjin Normal University, China

Xiaonan Zhao, Tianjin Normal University, China

Yue Wang, Tianjin Normal University , China

Yi Sun, Dalian University of Technology, China

Yanqing Guo, Dalian University of Technology, China

Ming Li, Dalian University of Technology, China

Bo Wang, Dalian University of Technology, China